Ultra-Robust Flexible Electronics by Laser-Driven Polymer-Nanomaterials Integration

Polyethylene terephthalate (PET) is the most widely used polymer in the world. For the first time, the laser-driven integration of aluminum nanoparticles (Al NPs) into PET to realize a laser-induced graphene/Al NPs/polymer composite, which demonstrates excellent toughness and high electrical conductivity with the formation of aluminum carbide into the polymer is shown. The conductive structures show an impressive mechanical resistance against >10000 bending cycles, projectile impact, hammering, abrasion, and structural and chemical stability when in contact with different solvents (ethanol, water, and aqueous electrolytes). Devices including thermal heaters, carbon electrodes for energy storage, electrochemical and bending sensors show this technology's practical application for ultra-robust polymer electronics. This laser-based technology can be extended to integrating other nanomaterials and create hybrid graphene-based structures with excellent properties in a wide range of flexible electronics’ applications.     

Freeze-drying and mechanical redispersion of aqueous PEDOT:PSS

Poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) films are attracting famous applications in antistatic coating, energy storage and conversion, printed electronics, and biomedical fields due to their conductivity, optical transparency and flexibility. However, PEDOT:PSS has poor dispersion stability during long-term storage and transport. Moreover, the dried PEDOT:PSS films are insoluble in any solvent and cannot be redispersed again. In comparison to bake drying, here, a feasible strategy to achieve mechanically redispersed PEDOT:PSS with the help of freeze-drying process was reported. The redispersed PEDOT:PSS can recover not only the initial characters such as pH, chemical composition, viscosity, and particle size under similar solid contents, but also conductivity and surface morphology of treated films. In addition, the treated film exhibits self-healing properties similar to pristine film in terms of mechanical and electrical properties. This technology enables reuse and overcomes the technical problems of PEDOT:PSS dispersion, realizing real-time processing to meet variable applications.     

Development of silicon wafer packaging technology for deep UV LED

This paper reports a deep‐ultraviolet LED (deep‐UV‐LED) package based on silicon MEMS process technology (Si‐PKG). The package consists of a cavity formed by silicon crystalline anisotropic etching, through‐silicon vias (TSVs) filled with electroplated Cu, bonding metals made of electroplated Ni/AuSn and a quartz lid for hermetic sealing. A deep‐UV LED die is directly mounted in the Si‐PKG by AuSn eutectic bonding without a submount. It has advantages in terms of size, heat dissipation, light utilization efficiency, productivity and cost over conventional AlN ceramic packages. We confirmed a light output of 30 mW and effective reflection on Si (111) cavity slopes in the Si‐PKG. Based on simulation, further improvement of the optical output is expected by optimizing DUV‐LED die mount condition.     

新型地锚张弦梁式泥石流格栅坝构件受力的简化计算方法

针对常见泥石流防治结构被冲击破坏的问题，基于“柔性消能”理念，结合张弦梁结构和竖向预应力锚杆技术，提出一种既能改善结构受力性能、增加结构整体抗冲击能力、保证结构安全可靠，又能减小结构构件截面尺寸、节约成本、便于现场施工组装和后期运营维护的新型地锚张弦梁式泥石流格栅坝，并阐述其技术原理。根据泥石流荷载分布和新型地锚张弦梁式泥石流格栅坝的受力特征，给出其简化的内力计算方法；并利用SAP2000建立新结构有限元模型，分析了结构的整体受力，验证了构件简化计算方法的合理性；结合Python语言和Qt De? signer软件开发了相应的设计计算软件，对新型地锚张弦梁式泥石流格栅坝的内力进行求解。结果表明：提出的新结构抗冲击性能好，构件受力均匀；以后设计中应关注竖杆的剪切脆性破坏和立柱偏心受力情况，保证结构安全；变形协调仅使底层张弦梁与竖杆内力偏大，实际工程应用时，应着重验算底层构件，防止其破坏；文中提出的简化计算方法能较准确的反映结构的受力特性，具有一定的合理性，研究可为新型地锚张弦梁式泥石流格栅坝的设计计算和推广应用提供理论依据和技术支持。     

Microstructure characterization and compressive performance of 3D needle-punched C/C–SiC composites fabricated by gaseous silicon infiltration

3D needle-punched C/C-SiC composites were fabricated from carbon fiber reinforced carbon (C/C) preforms, with densities of 1.05?g/cm³ and 1.28?g/cm³, by the gaseous silicon infiltration (GSI) method at fabrication temperatures from 1500?°C to 1800?°C. The compressive strengths and elastic moduli in transverse direction are larger than those measured under longitudinal compression except that samples fabricated from 1.28?g/cm³ density exhibit lower elastic moduli in transverse direction than in longitudinal direction. The compressive strength and modulus increase with fabrication temperature at 1500?°C and 1600?°C, and then decrease with higher fabrication temperature. Samples fabricated from the lower density C/C preforms have greater compressive strength and modulus. X-ray tomography was applied before and after the mechanical tests to characterize the microstructure and damage patterns, and the results indicated that for C/C-SiC composites fabricated at 1700?°C from 1.28?g/cm³ density C/C preform the matrix has a volume fraction (vol%) of 36.9%, and the initial intra-bundle cracks (0.6?vol%) display a space crossing structure while the inter-bundle pores (6.0?vol%) are special irregularly distributed.     

Acoustic damping flexible polyurethane foams: Effect of isocyanate index and water content on the soundproofing

High-efficiency sound absorbing flexible polyurethane foams (FPUFs) are manufactured using nonpolar polyester resin, methylene diphenyl diisocyanate, and other reagents by one-shot bulk polymerization. In this study, the impact of the isocyanate index (90, 100, and 110) and water content (2.5 and 5%) on the microphase separation and soundproofing behavior of FPUFs are examined using atomic force microscopy, Fourier transform infrared spectroscopy, optical microscope, and an impedance tube device. The results reveal that the increase of the isocyanate index and water content leads to the increase of the cell size, cell size distribution, open-cell content, cell wall roughness, and microphase separation. Also, maximum sound absorption coefficient (α) reaches to 0.98 and the average of α in the frequency range of 1500–4000 Hz increases from 0.7 to 0.87 by increasing the water content from 2.5 to 5% and isocyanate index from 90 to 110; therefore, acoustic damping performance enhances up to 26.24% due to the synergic effects of microphase separation on the viscose media formation, open-cell content, cell wall roughness, cell size, and cell size distribution. In conclusion, FPUFs with an optimal amount of microphase separation and drainage flow can be a promising candidate for sound insulating materials. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47363.     

单晶硅表层机械力学特性的各向异性分析

为探究挠性筋结构单晶硅材料的各向异性特性以及KOH腐蚀工艺对其力学性能的影响规律,进行纳米压痕实验,并结合原子力显微镜观察单晶硅表层3个主晶面上压痕裂纹形貌随晶向的变化规律,分析单晶硅材料表层弹性模量、硬度、断裂韧性等机械力学特性参数在(001)、(110)及(111)3个主要晶面上沿各个晶向的变化规律;分析挠性筋结构单晶硅材料(001)晶面的KOH腐蚀工艺对其材料表面机械特性的影响规律.结果表明:挠性筋单晶硅在(001)晶面上弹性模量的各向异性变化幅度明显,硬度及断裂韧性各向异性的变化幅度不大;挠性筋单晶硅在(110)晶面弹性模量和断裂韧性的各向异性变化幅度明显,硬度各向异性变化幅度不大;挠性筋单晶硅在(111)晶面硬度值、弹性模量及断裂韧性参数的变化幅度幅值均较小;确定了单晶硅表层3个晶面裂纹最易扩展的晶向方向,KOH腐蚀工艺使得单晶硅表面质量降低,腐蚀后暴露的表面微裂纹、缺陷等会使得单晶硅(001)晶面表层硬度、断裂韧性降低,从而降低了挠性筋结构的实际断裂强度.     

Relation between etching profile and voltage–current shape of sintered SiC etching by atmospheric pressure plasma

Sintered silicon carbide (SiC) was etched by a dielectric barrier discharge source. A high voltage bipolar pulse was used with helium gas for the plasma generation. One stable filament plasma was generated and could be used for SiC etching. As the processing gas (NF₃) mixing rate increased, the width and depth of the etching profile became narrower and deeper. The differentiated V–Q Lissajous method was used for measuring the capacitances (C_eq) of the electrode after the plasma turned on. The width of the etching profile was proportional to C_eq. As the current peak value I_smx of the substrate current increased, the volume removal rate of SiC increased. The etch depth was proportional to the ratio of I_smx to C_eq. Additionally, because of the different characteristics of the plasma disks on SiC substrate by the voltage polarity, the etching profile was unstable. However, in high NF₃ mixing process, the etching profile became stable and deeper.